C Sun aims to increase the proportion of consolidated revenues for advanced IC packaging equipment to 30% in 2021, according to company chairman Morris Liang.

C Sun currently has 45% of consolidated revenues coming from PCB equipment, 37% from display and touch panel equipment, and 10-12% from semiconductor equipment.

C Sun and fellow suppliers Gallant Precision Machining and Gallant Micro Machining have formed a G2C alliance for vertical cooperation to market equipment used in SiP, FO-WLP and CoWoS package, with C Sun supplying VPOs (vacuum pressure ovens), auto ovens, carrier bonders, BSF laminators and in-line plasma cleaners to match equipment supplied by the two partners.

By DIGITIMES