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IC test interface vendors keenly developing high-specs solutions for EV chips

IC test interfaces that can withstand high current of up to 1,000 A and high voltage of 1,200V will see a significant surge in demand for processing high-current driver ICs and other automotive electronics needed in EV production, according to industry sources.

The sources said AI, HPC and automotive chips all require the support of high-precision chip probing and system-level test (SLT) solutions, which are under active development by IC test interface specialist including Chunghwa Precision Test Tech (CHPT), WinWay Technology, Keystone Microtech and MPI.

As new energy vehicles will gradually replace traditional oil-fueled cars, they have completed the development of high-current/voltage solutions for testing large-specs driver chips for such vehicles and are pending client validations, the sources said.

Among them, WinWay is devoting more efforts to developing high-end measuring sockets and chip probing cards that can process large-size chips under high power (600W), high current and high voltage environments, the sources said

After landing a 70% share of the handset AP testing boards, CHPT is stepping up the development of probing cards featuring high speed, high pin counts and fine pitches and able to process networking, automotive and other niche chips in high temperature/voltage and current conditions, the sources said.

As a leading vendor of cantilever probe cards, MPI continues to develop wafer-level fine-pitch probe cards that can resist high current and support high speed transmission of HPC chips, the sources added.