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Cadence, Tower Semiconductor collaborate to advance automotive ICs

Cadence Design Systems and Tower Semiconductor, the leading analog solutions, announced a collaboration to advance automotive and mobile IC development.

The unique design challenges and analysis characteristics of automotive ICs require a carefully crafted combination of technologies and methodologies in order to satisfy the demanding ISO 26262 specification. By combining Cadence and Tower technologies, mutual customers can meet automotive design goals and achieve a faster path to ISO 26262 certification.

"Cadence and Tower have successfully collaborated for many years, delivering solutions for RF and silicon photonics, which help our mutual customers develop advanced offerings," said Dr. Anirudh Devgan, president and CEO of Cadence in a press release on July 14.

"The mutual work we're doing on the automotive reference flow focuses on enabling customers to develop critical automotive ICs, leveraging an integrated workflow using an all-Cadence toolset and a Tower reference design to develop compelling products faster," he added.

The objective of this collaboration is to develop a new, comprehensive automotive reference design flow that should result in a faster design cycle and the focus is on advanced automotive IC product development.

More specifically, the Cadence and Tower collaboration support automotive SoC design which enables customers to achieve SoC design excellence.