Shortage of foundry supply is sending major smartphone application processors vendors booking 12-inch fab capacity in advance to facilitate shipments of their power management ICs next year. Memory maker Winbond expects to run at full capacity next year to fulfill robust NOR flash chip orders. DIGITIMES recently talked to Stephen Ezell, ITIF VP of Global Innovation Policy, about why India and others should joint ITA-3.

Smartphone AP suppliers demanding 12-inch fab capacity for PWM ICs: Smartphone application processor vendors including Apple, Qualcomm and MediaTek have moved to reserve the available 12-inch BCD (bipolar-CMOS-DMOS) process capacity at foundries for their demand for power management ICs next year, according to industry sources.

Winbond to sustain full capacity for NOR flash memory till 2022: Winbond Electronics is expected to maintain full capacity utilization through next year to fulfill NOR flash chip orders, according to industry sources.

Why countries like India should join ITA-3: Q&A with Stephen Ezell, ITIF VP of Global Innovation Policy: The Information Technology and Innovation Foundation (ITIF) issued a report in September titled "How an Information Technology Agreement 3.0 would bolster global economic growth and opportunity," which is likely to ignite a new round of policy deliberation and debate among emerging countries that have not participated in the previous round of ITA.

By DIGITIMES